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In recent years, heat-sensitive electronic systems have been miniaturized far more than their heat-producing power supplies, leading to major design and reliability challenges — and making thermal management a critical design factor. This timely handbook covers all the practical issues that any packaging engineer must consider with regard to the thermal management of printed circuit boards, hybrid circuits, and multichip modules. Readers will also benefit from the extensive data on material properties and circuit functions, thus enabling more intelligent decisions at the design stage — and preventing thermal-related problems from occurring in the first place.
- Sales Rank: #3507152 in eBooks
- Published on: 1998-06-21
- Released on: 1998-06-21
- Format: Kindle eBook
From the Back Cover
The "hands-on" guide to thermal management! Thermal Management Handbook. In recent years, heat-sensitive electronics systems have been miniaturized far more than their heat-producing power supplies, leading to major design and reliability challenges - and making thermal management a critical design factor. This timely handbook is the most current and comprehensive reference on the practical issues that any packaging engineer must consider with regard to the thermal management f printed circuit boards, hybrid circuits, and multichip modules. In addition to presenting and exploring the three basic issues at the core of effective thermal management - how and where the heat is generated; how the temperature at a given point in the circuit is determined; and how the heat is removed - the book is enhanced with tutorial chapters, data tables, and a wealth of design examples. Professionals will also benefit from the extensive data on material properties and circuit functions, thus enabling more intelligent decisions at the design state - and preventing thermal-related problems from occurring in the first place.
About the Author
Jerry E. Sergent, Ph.D., is the Director of Technology for TCA, Inc. Al Krum is an Engineering Manager at Hughes Aircraft. He also teaches hybrid and MCM classes at UCLA and Berkeley, as well as for IMAPS.
Most helpful customer reviews
0 of 1 people found the following review helpful.
great as a reference but with some confusion
By Mahmoud Zreik
this book is good as a reference however the two authors gave contradictory and erroneous analysis on some pages
example: page 5.18 -5.19 totally contradicts page 7.10; 7.11.
and also in 7.10 W2 is totaly wrong with sin.
0 of 0 people found the following review helpful.
Great material, LOTS of errors and typos
By xar_cafe
This book has some great material that can't be found anywhere else, such as clear examples for calculating silicon dies thermal stresses and other electronic packaging niche topics. It's well written, but sometimes fails to provide justifications for some of the important assertions that the readers are forced to accept. The quantity of glaring typographical errors and errors in formulas made this otherwise great text just mediocre.
0 of 0 people found the following review helpful.
Excellent casual referance
By Amazon Customer
This book has achieved just the right balance between throughness and overview so that I have been able to refer to it in a casual manner (once every 3-6 months) and been able to use the results without taking a new college course. I am a practicing Analog electronics engineer and thermal engineering is something I only do once (perhaps more ?) during a design/project.
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